CNBT:Publications: Difference between revisions

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==Publications (41)==
<blockquote>
<biblio>
<li Adhesion of a Single-walled Carbon Nanotube on Hydrogen-terminated Silicon (111) Surface: Molecular Mechanics Simulation Approach<br>
Ji Il Choi and <B><u> Seung Soon Jang</u></B><br>
<i>Journal of Computational and Theoretical Nanoscience</i> accepted.<br>
<br>
<li>Probing Air-Liquid Interfacial Chemistry of Phospholipid Monolyers: Interactions and Reactivity of Surfactant Protein B in a Lipid Monolayer<br>
Hugh I. Kim, Hyungjun Kim, Young Shik Shin, Evan Neidholdt, Luther W. Beegle, <B> Seung Soon Jang</B>, James R. Heath, William A. Goddard III, Isik Kanik, and <u>J. L. Beauchamp</u> <br>
<i>Nature Chemistry</i> submitted.<br>
<br>
<li>Distribution and Diffusion of Water in Epoxy Molding Compound: Molecular Dynamics Simulation Approach<br>
Seung Geol Lee,<B><u> Seung Soon Jang</u></B>, Jongman Kim and Gene Kim <br>
<i>IEEE Transactions on Advanced Packaging</i> submitted.<br>
</biblio>
</blockquote>

Revision as of 21:02, 21 February 2009

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Publications (41)

  1. Adhesion of a Single-walled Carbon Nanotube on Hydrogen-terminated Silicon (111) Surface: Molecular Mechanics Simulation Approach

    Ji Il Choi and Seung Soon Jang

    Journal of Computational and Theoretical Nanoscience accepted.

  2. Probing Air-Liquid Interfacial Chemistry of Phospholipid Monolyers: Interactions and Reactivity of Surfactant Protein B in a Lipid Monolayer
    Hugh I. Kim, Hyungjun Kim, Young Shik Shin, Evan Neidholdt, Luther W. Beegle, Seung Soon Jang, James R. Heath, William A. Goddard III, Isik Kanik, and J. L. Beauchamp
    Nature Chemistry submitted.

  3. Distribution and Diffusion of Water in Epoxy Molding Compound: Molecular Dynamics Simulation Approach
    Seung Geol Lee, Seung Soon Jang, Jongman Kim and Gene Kim
    IEEE Transactions on Advanced Packaging submitted.
  4. [li]