Klapperich Lab:Notebook/Lab Meeting Notes/2008/09/23: Difference between revisions
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† SEPSIS Project/'''Chip Bonding Issues''' <br> | † SEPSIS Project/'''Chip Bonding Issues''' <br> | ||
* ZEONEX 690R, Tg, we measured it 141 C <br> | |||
* http://www.zeonex.com/datasheets.asp <br> | |||
* What is the STD temperature and pressure for bonding??? We need to nail this down.<br> | * What is the STD temperature and pressure for bonding??? We need to nail this down.<br> | ||
* What material are the plaques made out of? We should try to get resin that is the same material as the plaques that we bought (JP) <br> | * What material are the plaques made out of? We should try to get resin that is the same material as the plaques that we bought (JP) <br> |
Revision as of 10:32, 23 September 2008
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23 September 2008 Lab Meeting Agenda† Jaephil's research report. † Announcements
1. We are not changing the sample collection procedures at this time.
6. We are still going to split the VTM in our hood and take it over there.
† COBRA
And demonstrate ability to deliver the specified amount from the microfluidics.
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