Koch Lab:Protocols/Photolithography: Difference between revisions
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#*->center | #*->center | ||
#Manually adjust wafer if needed (repeat previous 2 steps until wafer is centered sufficiently) | #Manually adjust wafer if needed (repeat previous 2 steps until wafer is centered sufficiently) | ||
# | #Poor photo resist on the top side of the wafer | ||
#*->spin | #*->spin | ||
#*->ok | #*->ok |
Revision as of 15:00, 3 June 2008
Legend: "->" denotes physically pushing the button on the machine with the text that appears directly after symbol.
General Outline of process
- Spin
- Pre bake
- Expose
- Post bake
Procedure
Preheat hotplate for prebaking wafer
- ->set
- ->plate temp
- ->"desired temp"
- ->ent
Applying photo resist
- Place wafer on spin coating machine
- ->speed (input speed)
- ->accel (input acceleration)
- ->time (input time)
- ->save->back
- ->run process
- ->load recipe
- ->"file name"
- Manually center wafer by "eyeballing" it (this may take several tries)
- Turn on vacuum pump (manually)
- ->center
- Manually adjust wafer if needed (repeat previous 2 steps until wafer is centered sufficiently)
- Poor photo resist on the top side of the wafer
- ->spin
- ->ok
- Move wafer to hot plate
- wait 15 minutes
- Hook up vacuum hose to UV exposer
- Turn on Nitrogen
- UV exposer
- Pull white lever
- ->start
- wait for 200W
- ->Power
- ->visual align
- Tape mask onto glass (place glass side up)
- ->mask clamp
- Load wafer on tray below
- ->chuck vac
- Push slide in
- ->mask load
- ->visual align
- ->wafer load
- ->cont (pushes wafer against mask)
- Set time
- ->manual expose
- ->chuck vac
- remove wafer
- Post bake (5 mins)
- ->mask load
- ->mask clamp
- Take off slide
- Turn everything off!!!
- Place wafer in glass dish
- Poor in developer (6 mins)
- Take wafer out of developer
- At this point you can spray the wafer with ethanol to remove residual developer
- Can also use Nitrogen gas to blow off fluid/debris from wafer