Koch Lab:Protocols/Photolithography

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Line 23: Line 23:
#*->spin
#*->spin
#*->ok
#*->ok
 +
#Move wafer to hot plate
 +
#*wait 15 minutes
 +
#Hook up vacuum hose to UV exposer
 +
#Turn on Nitrogen
 +
#UV exposer
 +
#*Pull white lever
 +
#*->start
 +
#*wait for 200W
 +
#*->Power
 +
#*->visual align
 +
#*Tape mask onto glass (place glass side up)
 +
#**->mask clamp
 +
#*Load wafer on tray below
 +
#**->chuck vac
 +
#Push slide in
 +
#**->mask load
 +
#**->visual align
 +
#**->wafer load
 +
#**->cont (pushes wafer against mask)
 +
#*Set time
 +
#**->manual espose
 +
#*->chuck vac
 +
#*remove wafer

Revision as of 16:42, 3 June 2008

Legend: "->" denotes physically pushing the button on the machine with the text that appears directly after symbol.

Preheat hotplate for prebaking wafer

  • ->set
  • ->plate temp
  • ->"desired temp"
  • ->ent

Applying photo resist

  1. Place wafer on spin coating machine
    • ->speed (input speed)
    • ->accel (input acceleration)
    • ->time (input time)
    • ->save->back
    • ->run process
    • ->load recipe
    • ->"file name"
  2. Manually center wafer by "eyeballing" it (this may take several tries)
  3. Turn on vacuum pump (manually)
    • ->center
  4. Manually adjust wafer if needed (repeat previous 2 steps)
  5. poor photo resist
    • ->spin
    • ->ok
  6. Move wafer to hot plate
    • wait 15 minutes
  7. Hook up vacuum hose to UV exposer
  8. Turn on Nitrogen
  9. UV exposer
    • Pull white lever
    • ->start
    • wait for 200W
    • ->Power
    • ->visual align
    • Tape mask onto glass (place glass side up)
      • ->mask clamp
    • Load wafer on tray below
      • ->chuck vac
  10. Push slide in
      • ->mask load
      • ->visual align
      • ->wafer load
      • ->cont (pushes wafer against mask)
    • Set time
      • ->manual espose
    • ->chuck vac
    • remove wafer
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