Koch Lab:Protocols/Photolithography

From OpenWetWare

(Difference between revisions)
Jump to: navigation, search
Line 37: Line 37:
#*Load wafer on tray below
#*Load wafer on tray below
#**->chuck vac
#**->chuck vac
-
#Push slide in
+
#*Push slide in
#**->mask load
#**->mask load
#**->visual align
#**->visual align

Revision as of 17:42, 3 June 2008

Legend: "->" denotes physically pushing the button on the machine with the text that appears directly after symbol.

Preheat hotplate for prebaking wafer

  • ->set
  • ->plate temp
  • ->"desired temp"
  • ->ent

Applying photo resist

  1. Place wafer on spin coating machine
    • ->speed (input speed)
    • ->accel (input acceleration)
    • ->time (input time)
    • ->save->back
    • ->run process
    • ->load recipe
    • ->"file name"
  2. Manually center wafer by "eyeballing" it (this may take several tries)
  3. Turn on vacuum pump (manually)
    • ->center
  4. Manually adjust wafer if needed (repeat previous 2 steps)
  5. poor photo resist
    • ->spin
    • ->ok
  6. Move wafer to hot plate
    • wait 15 minutes
  7. Hook up vacuum hose to UV exposer
  8. Turn on Nitrogen
  9. UV exposer
    • Pull white lever
    • ->start
    • wait for 200W
    • ->Power
    • ->visual align
    • Tape mask onto glass (place glass side up)
      • ->mask clamp
    • Load wafer on tray below
      • ->chuck vac
    • Push slide in
      • ->mask load
      • ->visual align
      • ->wafer load
      • ->cont (pushes wafer against mask)
    • Set time
      • ->manual espose
    • ->chuck vac
    • remove wafer
Personal tools