Mathies:Protocols: Difference between revisions
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[[Mathies:Glass_Etching|Glass Etching]] <br style="clear:both;"/> | [[Mathies:Glass_Etching|Glass Etching]] <br style="clear:both;"/> | ||
[[Mathies:Drilling_a_Glass_Microfluidic_Wafer|Drilling a Glass Microfluidic Wafer]] <br style="clear:both;"/> | [[Mathies:Drilling_a_Glass_Microfluidic_Wafer|Drilling a Glass Microfluidic Wafer]] <br style="clear:both;"/> | ||
[[Mathies: | [[Mathies:Metal_Deposition|Metal Deposition]] <br style="clear:both;"/> | ||
[[Mathies:Metal_Etching|Metal Etching]] <br style="clear:both;"/> | |||
[[Mathies:Glass_Bonding|Glass Bonding]] <br style="clear:both;"/> |
Revision as of 17:32, 15 July 2009
Valves and Assembly Protocols
Microfabrication
Mask Making
Wafers Cleaning and Deposition
Photolithography
RIE Thin Film Silicon Etching
Glass Etching
Drilling a Glass Microfluidic Wafer
Metal Deposition
Metal Etching
Glass Bonding