UA Biophysics:Protocols:Microfluidics Valves: Difference between revisions
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1. | ==Upper Section (Control Layer)== | ||
1. Mix PDMS with curing agent 5:1 respectively (30 g PDMS - 6g Curing Agent) inside a plastic glass and use a plastic fork to mix during 5 minutes<br> | |||
2. Place the mixture inside the degasser for 60 min until all bubbles are gone<br> | |||
3. Pour the mixture over the master<br> | |||
4. Place the master at 65°C for 33 min<br> | |||
5.Leave PDMS for two hours at room temperature<br> | |||
==Lower Section (Flow Layer)== | |||
1. Mix PDMS with curing agent in a 20:1 proportion (20g PDMS: 1g Curing Agent) | |||
2. Pour only a little PDMS on the wafer | |||
3. Use dirty sticky tape to place the master on the spinner | |||
4. Spin for 1 min at 2500 RPM | |||
5. Place the wafer @ 65°C for 33 min | |||
6. Let the wafer cool down at room temperature for two hours | |||
==Thermal Bonding== | |||
1. Take both stacks out from the oven | |||
2. Punch holes with 3/4 mm puncher in the upper layer | |||
3. Cut the squares for the upper layer with a new razor blade and clean the chip with magic tape | |||
4. Place the upper layer chips on the lower layer so that rectangles match | |||
5. Place bonded surfaces @ 65°C for 4 hours | |||
6. Cut whole chips from wafer with a new razor blade | |||
7. Punch holes for the flow layer | |||
[[UA Biophysics:Protocols|Return to Protocols]]<br> | [[UA Biophysics:Protocols|Return to Protocols]]<br> | ||
Revision as of 14:40, 31 July 2015
Upper Section (Control Layer)
1. Mix PDMS with curing agent 5:1 respectively (30 g PDMS - 6g Curing Agent) inside a plastic glass and use a plastic fork to mix during 5 minutes
2. Place the mixture inside the degasser for 60 min until all bubbles are gone
3. Pour the mixture over the master
4. Place the master at 65°C for 33 min
5.Leave PDMS for two hours at room temperature
Lower Section (Flow Layer)
1. Mix PDMS with curing agent in a 20:1 proportion (20g PDMS: 1g Curing Agent) 2. Pour only a little PDMS on the wafer 3. Use dirty sticky tape to place the master on the spinner 4. Spin for 1 min at 2500 RPM 5. Place the wafer @ 65°C for 33 min 6. Let the wafer cool down at room temperature for two hours
Thermal Bonding
1. Take both stacks out from the oven 2. Punch holes with 3/4 mm puncher in the upper layer 3. Cut the squares for the upper layer with a new razor blade and clean the chip with magic tape 4. Place the upper layer chips on the lower layer so that rectangles match 5. Place bonded surfaces @ 65°C for 4 hours 6. Cut whole chips from wafer with a new razor blade 7. Punch holes for the flow layer
